The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

May. 26, 2021
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Hideyo Nakamura, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 24/16 (2013.01); H01L 25/072 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1067 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1302 (2013.01); H01L 2924/13032 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A semiconductor device includes: a plurality of semiconductor chips each including a first main electrode on a top surfaces and including a second main electrode and a control electrode on a bottom surface; a first common main electrode connected to the first main electrodes; a printed board including a control wiring part and a main wiring part provided on a bottom surface of an insulating layer, and a common control electrode and a second common main electrode provided on a top surface of the insulating layer and electrically connected to the control wiring part and the main wiring part; projection electrodes bonding the control electrodes to the control wiring part; projection electrodes bonding the second main electrodes to the main wiring part; and a sealing member sealing the semiconductor chips and exposing the first common main electrode, the common control electrode, and the second common main electrode.


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