The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Apr. 23, 2019
Fuji Polymer Industries Co., Ltd., Nagoya, JP;
Setsuo Kikuchi, Aichi, JP;
Takumi Kataishi, Aichi, JP;
Fuji Polymer Industries Co., Ltd., Aichi, JP;
Abstract
A heat conductive sheet of the present invention is a heat conductive sheet containing a curing reaction catalyst, wherein a heat conductive uncured compositionnot containing a curing reaction catalyst is joined to at least one principal surface of the heat conductive sheetcontaining a curing reaction catalyst. The heat conductive sheetcontaining a curing reaction catalyst contains the curing reaction catalyst in an amount necessary to cure the heat conductive uncured composition. A mounting method of the present invention includes: joining a heat conductive uncured compositionnot containing a curing reaction catalyst to at least one principal surface of the heat conductive sheetcontaining a curing reaction catalyst, and curing the heat conductive uncured composition by diffusion of the curing reaction catalyst contained in the heat conductive sheet. Thereby, the heat conductive uncured composition can be joined to the heat conductive sheet immediately before mounting to an electronic component or the like, easily follow the unevenness of a heat generating part and/or heat dissipating part, and cure after mounting.