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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11449180 B1

PDFFull Text
Date of Patent:
Sep. 20, 2022

Filed:

Feb. 16, 2018

Method for manufacturing substrate equipped with wiring electrode, and substrate equipped with wiring electrode

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Kohei Takase, Otsu, JP;

Tsukuru Mizuguchi, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Ricardo Osorio

Int. Cl.
CPC ...
G06F 3/044 (2006.01); G02F 1/1362 (2006.01); G06F 3/045 (2006.01); G06F 3/046 (2006.01); G03F 7/023 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0443 (2019.05); G02F 1/136209 (2013.01); G02F 1/136286 (2013.01); G03F 7/023 (2013.01); G03F 7/2002 (2013.01); G03F 7/2022 (2013.01); G06F 3/045 (2013.01); G06F 3/046 (2013.01); G06F 3/0445 (2019.05);
Abstract

The present invention provides a method for manufacturing a substrate equipped with a wiring electrode which has a fine pattern and is excellent in conductivity and in which an opaque wiring electrode is hardly visible. Disclosed is a method for manufacturing a substrate equipped with a wiring electrode including the steps of forming an opaque wiring electrode on at least one side of a transparent substrate, applying a positive photosensitive composition on one side of the transparent substrate, and exposing and developing the positive photosensitive composition using the opaque wiring electrode as a mask to form a functional layer at a portion corresponding to the opaque wiring electrode.

Find Patent Forward Citations

Takase, Kohei. (2022). Method for manufacturing substrate equipped with wiring electrode, and substrate equipped with wiring electrode (U.S. Patent No. 11449180). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11449180

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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