The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Mar. 13, 2020
Applicant:

Nec Corporation, Tokyo, JP;

Inventors:

Tan Azuma, Tokyo, JP;

Yusuke Kikuchi, Tokyo, JP;

Kousuke Ishida, Tokyo, JP;

Shunsuke Akimoto, Tokyo, JP;

Kenichiro Fujiyama, Tokyo, JP;

Shinji Oominato, Tokyo, JP;

Assignee:

NEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 33/00 (2006.01); A01G 24/00 (2018.01); G01N 29/12 (2006.01); G01N 29/44 (2006.01);
U.S. Cl.
CPC ...
G01N 33/0098 (2013.01); A01G 24/00 (2018.02); G01N 29/12 (2013.01); G01N 29/4436 (2013.01);
Abstract

A plant monitoring apparatusincludes: a soil state estimation unitthat estimates a state of soil by, with use of frequency association information calculated based on vibration measured via the soil, referencing soil state estimation information in which the frequency association information and information indicating states of the soil are associated with soil states; and a plant state estimation unitthat estimates a state of a plant by, with use of growth association information that was calculated based on vibration of the plant and indicates growth of the plant, referencing plant state estimation information in which the growth association information and information indicating states of the plant above a plant soil surface are associated with plant states above the plant soil surface.


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