The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Dec. 21, 2015
Applicant:

United Technologies Corporation, Hartford, CT (US);

Inventors:

Wei Xie, East Hartford, CT (US);

Subramanyaravi Annapragada, Shrewsbury, MA (US);

Joseph V. Mantese, Ellington, CT (US);

Parmesh Verma, South Windsor, CT (US);

Thomas D. Radcliff, Vernon, CT (US);

William A. Rioux, Willington, CT (US);

Assignee:

UNITED TECHNOLOGIES CORPORATION, Hartford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 21/00 (2006.01); F25B 41/20 (2021.01); H01L 37/02 (2006.01); F25B 49/00 (2006.01); F25B 49/02 (2006.01); C08F 214/22 (2006.01);
U.S. Cl.
CPC ...
F25B 41/20 (2021.01); F25B 21/00 (2013.01); F25B 49/00 (2013.01); F25B 49/02 (2013.01); H01L 37/02 (2013.01); H01L 37/025 (2013.01); C08F 214/22 (2013.01); F25B 2321/001 (2013.01);
Abstract

A method of making an electrocaloric element includes forming conductive layers on opposing surfaces of a film comprising an electrocaloric material to form an electrocaloric element, wherein the forming of the conductive layers includes one or more of: vapor deposition of the conductive layers under reduced pressure for a duration of time, wherein the duration of time under reduced pressure is less than 240 minutes; vapor deposition of the conductive layers under reduced pressure for a duration of time, wherein the duration of time of exposure to conductive material deposition is less than 240 minutes; vapor deposition of the conductive layers under reduced pressure, wherein the reduced pressure is 10torr to 500 torr; or maintaining the film at a temperature of less than or equal to 200° C. during forming of the conductive layers.


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