The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Sep. 28, 2019
Applicant:

Giga-byte Technology Co., Ltd., New Taipei, TW;

Inventors:

Shun-Chih Huang, New Taipei, TW;

Tai-Chuan Mao, New Taipei, TW;

Yi-Jhen Lin, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05D 15/00 (2006.01); F16K 17/00 (2006.01); F16K 11/16 (2006.01); F16K 27/12 (2006.01); F16K 39/04 (2006.01); F28F 13/08 (2006.01); F28F 27/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F16K 17/003 (2013.01); F16K 11/168 (2013.01); F16K 27/12 (2013.01); F16K 39/045 (2013.01); F28F 13/08 (2013.01); F28F 27/02 (2013.01); F28F 2250/04 (2013.01); H05K 7/2039 (2013.01);
Abstract

A heat dissipation assembly includes a case and a partition structure. The case has a chamber. The partition structure includes a partition wall vertically disposed in the chamber to separate a first flow path and a second flow path in the chamber, and the partition wall has a breach and a valve structure disposed at the breach, wherein the valve structure covers the breach when the valve structure is not pushed open. When a fluid pressure existed in a section of one of the first flow path and the second flow path which is adjacent to the valve structure is greater than a fluid pressure existed in a section of the other one of the first flow path and the second flow path which is adjacent to the valve structure, the valve structure is pushed away to expose at least a part of the breach.


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Huang, Shun-Chih. (2022). Heat dissipation assembly (U.S. Patent No. 11448331). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11448331

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