The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Aug. 20, 2020
Applicant:

Tesa SE, Norderstedt, DE;

Inventors:

Thilo Dollase, Hamburg, DE;

Jessika Gargiulo, Hamburg, DE;

Marco Kupsky, Quickborn, DE;

Bastian Wedel, Hamburg, DE;

Assignee:

TESA SE, Norderstedt, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/06 (2006.01); C09J 11/06 (2006.01); C09J 7/22 (2018.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); C08L 33/06 (2006.01); C09J 7/38 (2018.01); C09J 5/06 (2006.01);
U.S. Cl.
CPC ...
C09J 133/068 (2013.01); C08L 33/06 (2013.01); C09J 5/06 (2013.01); C09J 7/22 (2018.01); C09J 7/385 (2018.01); C09J 11/06 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); C08F 2800/20 (2013.01); C09J 2203/326 (2013.01); C09J 2301/302 (2020.08); C09J 2301/312 (2020.08); C09J 2433/00 (2013.01);
Abstract

Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group; and (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent configured to induce curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation.


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