The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Nov. 01, 2018
Applicant:
Koki Company Limited, Tokyo, JP;
Inventors:
Takeshi Yahagi, Tokyo, JP;
Kazuhiro Yukikata, Tokyo, JP;
Koichi Sekiguchi, Tokyo, JP;
Yusuke Satoh, Tokyo, JP;
Tatsuya Baba, Tokyo, JP;
Mitsuyasu Furusawa, Tokyo, JP;
Assignee:
KOKI COMPANY LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); C08G 59/24 (2006.01); C08G 59/50 (2006.01); C08L 63/02 (2006.01); C09J 163/02 (2006.01); C08L 63/00 (2006.01); C08G 59/22 (2006.01); C08K 5/053 (2006.01); C08K 5/09 (2006.01); C08K 5/20 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/226 (2013.01); C08G 59/245 (2013.01); C08G 59/5006 (2013.01); C08G 59/5026 (2013.01); H01L 21/56 (2013.01); H01L 21/563 (2013.01); C08K 5/053 (2013.01); C08K 5/09 (2013.01); C08K 5/20 (2013.01); C08L 2203/206 (2013.01);
Abstract
Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.