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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11446902 B1

PDFFull Text
Date of Patent:
Sep. 20, 2022

Filed:

Jun. 28, 2018

Packaging material for molding, exterior case for electricity storage device and electricity storage device

Applicant:

Showa Denko Packaging Co., Ltd., Kanagawa, JP;

Inventors:

Kenji Yoshino, Kanagawa, JP;

Yuji Minamibori, Kanagawa, JP;

Katsumi Tanaka, Kanagawa, JP;

Assignee:

SHOWA DENKO PACKAGING CO., LTD., Kanagawa, JP;

Attorneys:

Millen White Zelano and Branigan, PC

Csaba Henter

Primary Examiner:

Vivian Chen

Int. Cl.
CPC ...
B32B 15/09 (2006.01); B32B 7/12 (2006.01); B32B 27/36 (2006.01); C09J 175/06 (2006.01); H01M 50/10 (2021.01); B32B 37/12 (2006.01); B32B 37/16 (2006.01); B32B 38/00 (2006.01); H01M 50/121 (2021.01); H01G 11/78 (2013.01); H01M 50/105 (2021.01); H01M 50/131 (2021.01); C09J 175/04 (2006.01); H01M 50/124 (2021.01); B65D 65/40 (2006.01); H01M 50/116 (2021.01); H01M 50/119 (2021.01); H01M 50/126 (2021.01); H01M 50/129 (2021.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
B32B 15/09 (2013.01); B32B 7/12 (2013.01); B32B 15/20 (2013.01); B32B 27/36 (2013.01); C09J 175/06 (2013.01); H01M 50/10 (2021.01); B32B 37/12 (2013.01); B32B 37/16 (2013.01); B32B 38/0036 (2013.01); B32B 2037/1253 (2013.01); B32B 2250/03 (2013.01); B32B 2250/04 (2013.01); B32B 2307/31 (2013.01); B32B 2307/50 (2013.01); B32B 2307/546 (2013.01); B32B 2307/708 (2013.01); B32B 2311/24 (2013.01); B32B 2367/00 (2013.01); B32B 2439/40 (2013.01); B32B 2457/10 (2013.01); B65D 65/40 (2013.01); C09J 175/04 (2013.01); C09J 2203/33 (2013.01); H01G 11/78 (2013.01); H01M 50/105 (2021.01); H01M 50/116 (2021.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/124 (2021.01); H01M 50/126 (2021.01); H01M 50/129 (2021.01); H01M 50/131 (2021.01); Y10T 428/1355 (2015.01); Y10T 428/1359 (2015.01); Y10T 428/1376 (2015.01); Y10T 428/1383 (2015.01); Y10T 428/31565 (2015.04); Y10T 428/31605 (2015.04); Y10T 428/31681 (2015.04); Y10T 428/31786 (2015.04);
Abstract

Provided is a molding packaging material capable of sealing without causing sealing failure, significantly reducing cleaning frequency of a seal bar to improve productivity, and preventing occurrence of delamination. The molding packaging material includes a PBT terephthalate (PBT) layer, a heat fusible resin layer, and a metal foil layerbetween the two layers. The PBT layerand the metal foil layerare bonded via an outer adhesive layer. The outer adhesive layeris formed of a urethane adhesive cured film composed of a polyester polyol, a polyfunctional isocyanate compound, and polyhydric alcohol. The polyester polyol contains a dicarboxylic acid component, the dicarboxylic acid component includes an aromatic dicarboxylic acid. The dicarboxylic acid component contains an aromatic dicarboxylic acid. The content rate of the aromatic dicarboxylic acid in the dicarboxylic acid component is 40 mol % to 80 mol %. The Young's modulus of the cured film of the urethane adhesive is 70 MPa to 400 MPa. The PBT layer has tensile strength of 100 MPa to 300 MPa.

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