The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Jul. 29, 2021
Samsung Display Co., Ltd., Yongin-Si, KR;
Chan-Jae Park, Suwon-si, KR;
Minsoo Kim, Seoul, KR;
Yoona Kim, Hwaseong-si, KR;
Soo Yeon Han, Gwacheon-si, KR;
Sunok Oh, Hwaseong-si, KR;
Kikyung Youk, Bucheon-si, KR;
Sangduk Lee, Yongin-si, KR;
Hyun A Lee, Seoul, KR;
SAMSUNG DISPLAY CO., LTD., Gyeonggi-do, KR;
Abstract
An ultrasonic bonding apparatus includes a stage having an upper surface on a plane defined by a first direction and a second direction crossing the first direction, a head part spaced apart from the stage in a third direction crossing the first direction and the second direction, a first ultrasonic generator which vibrates in a direction parallel to the first direction, and a second ultrasonic generator which vibrates in a direction parallel to the third direction, where each of the first ultrasonic generator and the second ultrasonic generator may be coupled to the stage or the head part.