The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Mar. 11, 2020
Applicant:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventors:

Junhua Wei, Palo Alto, CA (US);

Anne Plochowietz, Palo Alto, CA (US);

Kent Evans, Sunnyvale, CA (US);

Sean E. Doris, San Francisco, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/188 (2017.01); B29C 64/118 (2017.01); B29C 64/153 (2017.01); C23C 18/54 (2006.01); G06T 17/00 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); B33Y 40/20 (2020.01); B29K 55/02 (2006.01); B29K 67/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/188 (2017.08); B29C 64/118 (2017.08); B29C 64/153 (2017.08); C23C 18/54 (2013.01); G06T 17/00 (2013.01); B29K 2055/02 (2013.01); B29K 2067/046 (2013.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); C08K 2201/001 (2013.01);
Abstract

Additive manufacturing compositions and methods for fabricating a conductive article with the same are provided. The additive manufacturing composition may include a 3D printable material and a metal precursor disposed in the 3D printable material. The metal precursor may include a metal salt, a metal particle, or combinations thereof. The method may include forming a first layer of the article on a substrate, where the first layer includes the additive manufacturing composition, forming a second layer of the article adjacent the first layer, and binding the first layer with the second layer to fabricate the article. The method may also include plating a metal on at least a portion of the article to fabricate the conductive article.


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