The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Jan. 03, 2019
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Nick S. Evans, Lynnwood, WA (US);

Bradley J. Mitchell, Snohomish, WA (US);

Mark Blumenkrantz, Huntington Beach, CA (US);

Assignee:

THE BOEING COMPANY, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/364 (2014.01); B23K 26/06 (2014.01); B23K 26/08 (2014.01); B23K 26/12 (2014.01); B23K 26/38 (2014.01); B23K 101/32 (2006.01); B23K 101/38 (2006.01); B23K 101/34 (2006.01);
U.S. Cl.
CPC ...
B23K 26/364 (2015.10); B23K 26/0604 (2013.01); B23K 26/0823 (2013.01); B23K 26/123 (2013.01); B23K 26/127 (2013.01); B23K 26/1224 (2015.10); B23K 26/38 (2013.01); B23K 2101/32 (2018.08); B23K 2101/34 (2018.08); B23K 2101/38 (2018.08);
Abstract

A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.


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