The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Sep. 27, 2016
Applicant:
Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v., Munich, DE;
Inventors:
Holger Lausch, Leipzig, DE;
Mathias Herrmann, Coswig, DE;
Bernd Gronde, Schleifreisen, DE;
Thomas Toeppel, Bischofswerda, DE;
Romy Petters, Dresden, DE;
Christian Rotsch, Dresden, DE;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/354 (2014.01); B22F 7/08 (2006.01); G01D 11/24 (2006.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); B33Y 40/00 (2020.01); A61F 2/30 (2006.01); A61F 2/36 (2006.01); B22F 10/20 (2021.01); B23K 26/34 (2014.01); A61F 2/46 (2006.01); B22F 5/10 (2006.01); A61F 2/48 (2006.01); C23C 4/134 (2016.01); C23C 4/08 (2016.01);
U.S. Cl.
CPC ...
B23K 26/354 (2015.10); A61F 2/3094 (2013.01); A61F 2/36 (2013.01); B22F 7/08 (2013.01); B22F 10/20 (2021.01); B23K 26/34 (2013.01); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B33Y 80/00 (2014.12); G01D 11/245 (2013.01); A61F 2/4657 (2013.01); A61F 2/482 (2021.08); A61F 2002/30087 (2013.01); A61F 2002/30593 (2013.01); A61F 2002/30985 (2013.01); B22F 5/10 (2013.01); C23C 4/08 (2013.01); C23C 4/134 (2016.01); Y02P 10/25 (2015.11);
Abstract
The invention relates to a composite body, wherein at least one functional component is integrated into a shaped product, and to a method for producing the same. The shaped product can especially be an implant, a prosthesis, an industrial component or a multifunctionally useful sensor platform for the monitoring of materials, components and/or structural systems.