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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11446762 B1

PDFFull Text
Date of Patent:
Sep. 20, 2022

Filed:

Jun. 02, 2017

Laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device

Applicant:

Jsw Aktina System Co., Ltd., Yokohama, JP;

Inventors:

Takahiro Fuji, Yokohama, JP;

Yuki Suzuki, Yokohama, JP;

Takahiro Mikami, Yokohama, JP;

Yoshihiro Yamaguchi, Yokohama, JP;

Assignee:

JSW AKTINA SYSTEM CO., LTD., Kanagawa, JP;

Attorney:

SGPatents PLLC

Primary Examiner:

Dana Ross

Assistant Examiner:

Joseph W Iskra

Int. Cl.
CPC ...
B23K 26/10 (2006.01); H01L 21/20 (2006.01); H01L 21/268 (2006.01); B23K 26/073 (2006.01); B23K 26/08 (2014.01); B23K 37/04 (2006.01); B23K 26/70 (2014.01); H01L 21/677 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); B65G 51/03 (2006.01); B23K 103/00 (2006.01); B23K 101/18 (2006.01); B23K 101/40 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
B23K 26/10 (2013.01); B23K 26/0738 (2013.01); B23K 26/0838 (2013.01); B23K 26/702 (2015.10); B23K 37/0408 (2013.01); H01L 21/20 (2013.01); H01L 21/268 (2013.01); H01L 21/6776 (2013.01); H01L 21/67115 (2013.01); H01L 21/67784 (2013.01); H01L 21/683 (2013.01); B23K 2101/18 (2018.08); B23K 2101/40 (2018.08); B23K 2103/172 (2018.08); B23K 2103/50 (2018.08); B65G 51/03 (2013.01);
Abstract

A laser irradiation apparatus () according to one embodiment irradiates a workpiece () with a laser beam () while conveying the workpiece () caused to float with the use of a flotation unit (). The flotation unit () includes precision float regions () and rough float regions (to). The precision float regions () are configured to cause the workpiece () to float by utilizing ejection and suction of a gas, and the rough float regions are configured to cause the workpiece () to float by utilizing ejection of a gas without suction of a gas.

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