The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Aug. 15, 2017
Applicant:
Diamet Corporation, Niigata, JP;
Inventors:
Assignee:
Diamet Corporation, Niigata, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 5/10 (2006.01); B30B 11/02 (2006.01); B22F 3/03 (2006.01);
U.S. Cl.
CPC ...
B22F 5/10 (2013.01); B30B 11/027 (2013.01); B22F 2003/033 (2013.01);
Abstract
The molding die of the invention includes: a first die having a through-hole; a second die inserted into the through-hole and capable of moving relative to the first die; and a first punch and a second punch each insertable into the through-hole. A cavity surrounded by the second die, the first punch, and the second punch to compression-mold a molding object is formed in the through-hole. An undercut molding part is formed in the surface of the second die facing the cavity. The second die is formed so as to be splittable into two or more split bodies.