The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
May. 08, 2020
Hrl Laboratories, Llc, Malibu, CA (US);
John H. Martin, Oxnard, CA (US);
Tobias A. Schaedler, Oak Park, CA (US);
Brennan Yahata, Los Angeles, CA (US);
Jacob M. Hundley, Thousand Oaks, CA (US);
Jason A. Graetz, Calabasas, CA (US);
Adam F. Gross, Santa Monica, CA (US);
William Carter, Calabasas, CA (US);
HRL Laboratories, LLC, Malibu, CA (US);
Abstract
Disclosed herein are surface-functionalized powders which alter the solidification of the melted powders. Some variations provide a powdered material comprising a plurality of particles fabricated from a first material, wherein each of the particles has a particle surface area that is continuously or intermittently surface-functionalized with nanoparticles and/or microparticles selected to control solidification of the powdered material from a liquid state to a solid state. Other variations provide a method of controlling solidification of a powdered material, comprising melting at least a portion of the powdered material to a liquid state, and semi-passively controlling solidification of the powdered material from the liquid state to a solid state. Several techniques for semi-passive control are described in detail. The methods may further include creating a structure through one or more techniques selected from additive manufacturing, injection molding, pressing and sintering, capacitive discharge sintering, or spark plasma sintering.