The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Aug. 20, 2019
Applicant:

Dare Mb Inc., San Diego, CA (US);

Inventor:

Robert Farra, Acton, MA (US);

Assignee:

Dare MB Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); A61M 31/00 (2006.01); A61B 5/00 (2006.01); A61K 9/00 (2006.01); A61B 5/07 (2006.01); B23K 20/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); A61B 5/076 (2013.01); A61B 5/4839 (2013.01); A61B 5/6861 (2013.01); A61K 9/0097 (2013.01); A61M 31/002 (2013.01); B01L 3/502715 (2013.01); B23K 20/00 (2013.01); A61B 2562/12 (2013.01); A61B 2562/168 (2013.01); A61M 2205/0244 (2013.01); A61M 2207/00 (2013.01); B01L 2200/0689 (2013.01); B01L 2200/12 (2013.01); B01L 2300/042 (2013.01); B01L 2300/0819 (2013.01); B01L 2300/0848 (2013.01); B01L 2300/0858 (2013.01); B01L 2300/12 (2013.01); Y10T 29/49126 (2015.01);
Abstract

Systems and methods for sealing a plurality of reservoirs of a microchip element with a sealing grid are provided. For example, in one embodiment, a microchip element comprises a primary substrate having a plurality of reservoirs defined therein. The microchip element also includes a single continuous sealing groove defined in the primary substrate that extends around each of the plurality of reservoirs. In addition, the microchip element includes a sealing substrate comprising a single continuous sealing protrusion extending therefrom. The single continuous sealing protrusion corresponds to and is configured to mate with the single continuous sealing groove to form a hermetic bond between the primary substrate and the sealing substrate. In this manner, the single continuous sealing groove and the single continuous sealing protrusion form a sealing grid about the plurality of reservoirs.


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