The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Dec. 24, 2019
Applicant:

Conductive Composites Company Ip, Llc, Heber City, UT (US);

Inventors:

George Clayton Hansen, Midway, UT (US);

Nathan D. Hansen, Heber, UT (US);

Jared Thompson Weese, Heber, UT (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); H05K 9/00 (2006.01); B32B 15/20 (2006.01); B32B 15/08 (2006.01); B32B 5/02 (2006.01); B32B 9/04 (2006.01); E04C 2/26 (2006.01); E04F 13/075 (2006.01); E04F 13/08 (2006.01); E06B 5/18 (2006.01); E04F 13/00 (2006.01); B32B 27/10 (2006.01); C23C 16/06 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0001 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 9/041 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/10 (2013.01); E04C 2/26 (2013.01); E04F 13/002 (2013.01); E04F 13/075 (2013.01); E04F 13/0875 (2013.01); E06B 5/18 (2013.01); H05K 9/0003 (2013.01); H05K 9/0005 (2013.01); H05K 9/009 (2013.01); H05K 9/0088 (2013.01); H05K 9/0094 (2013.01); B32B 2255/205 (2013.01); B32B 2260/028 (2013.01); B32B 2260/046 (2013.01); B32B 2307/212 (2013.01); B32B 2607/00 (2013.01); B32B 2607/02 (2013.01); C23C 16/06 (2013.01); E04F 13/0801 (2013.01);
Abstract

The electromagnetic shielding of an enclosable building structure is provided by applying a shielding wallcovering to at least a portion of building structure. The shielding wall covering is wallpaper comprising a metal-coated substrate core and resin. To connect the shielded wallpaper to the building structure a layer of the resin or an adhesive layer may be used.


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