The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Apr. 14, 2021
Applicant:
Skyworks Solutions, Inc., Irvine, CA (US);
Inventor:
Ki Wook Lee, Irvine, CA (US);
Assignee:
Skyworks Solutions, Inc., Irvine, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 13/00 (2006.01); H05K 3/46 (2006.01); H01Q 1/38 (2006.01); H05K 1/16 (2006.01); H05K 3/00 (2006.01); H01Q 9/04 (2006.01); H05K 3/06 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4697 (2013.01); H01Q 1/38 (2013.01); H05K 1/165 (2013.01); H05K 3/4623 (2013.01); H05K 3/4655 (2013.01); H01Q 9/0407 (2013.01); H05K 3/005 (2013.01); H05K 3/0026 (2013.01); H05K 3/0047 (2013.01); H05K 3/06 (2013.01); H05K 3/4038 (2013.01); H05K 3/429 (2013.01); H05K 2201/10098 (2013.01); Y10T 29/49016 (2015.01);
Abstract
A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.