The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Apr. 22, 2020
Applicants:
Soken, Inc., Nisshin, JP;
Denso Corporation, Kariya, JP;
Inventors:
Assignees:
SOKEN, INC., Nisshin, JP;
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01P 3/08 (2006.01); H01P 3/12 (2006.01); H01P 5/02 (2006.01); H01P 5/08 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0251 (2013.01); H01P 3/082 (2013.01); H01P 3/088 (2013.01); H01P 3/121 (2013.01); H01P 5/028 (2013.01); H01P 5/085 (2013.01);
Abstract
A signal via has a via diameter that causes a high-frequency signal to be propagated through a high-frequency transmission line causing multi mode propagation (multi-mode interference propagation). At least one of the inter-via distance between the signal via and respective ground vias, the via diameter, and the thickness of the multilayer substrate is determined to introduce the high-frequency signal from the interlayer transmission line to the signal lines in the high-intensity region of the multi mode propagation.