The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Oct. 12, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Tae Hong Min, Suwon-si, KR;

Ju Ho Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/00 (2006.01); H05K 1/02 (2006.01); H01Q 1/12 (2006.01); H01Q 21/06 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0243 (2013.01); H01Q 1/12 (2013.01); H01Q 21/065 (2013.01); H05K 1/0277 (2013.01); H05K 1/0353 (2013.01); H05K 1/115 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A printed circuit board has a first stacked body having a flexible region and a rigid region, and a second stacked body disposed on the rigid region of the first stacked body. The first stacked body includes a plurality of first insulating layers, a plurality of first bonding layers, and a plurality of first wiring layers. The second stacked body includes a plurality of second insulating layers and a plurality of second wiring layers, and each of the plurality of first bonding layers integrally covers at least a portion of upper and side surfaces of a respective first wiring layer of the plurality of first wiring layers.


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