The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Apr. 01, 2020
Applicant:

Denso Corporation, Aichi-pref., JP;

Inventors:

Tatsuya Kamiya, Kariya, JP;

Itaru Ishii, Kariya, JP;

Tomoki Tanemura, Kariya, JP;

Takashi Aoki, Kariya, JP;

Tetsuya Katoh, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 17/02 (2006.01); B81B 7/00 (2006.01); H04R 19/00 (2006.01); G01H 11/08 (2006.01); G01N 29/12 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 17/02 (2013.01); B81B 7/0041 (2013.01); G01H 11/08 (2013.01); G01N 29/12 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); H04R 2499/13 (2013.01);
Abstract

An ultrasonic sensor includes: an element storage case including a case-side diaphragm having a thickness direction along a directional axis; and an ultrasonic element accommodated in the element storage case and spaced apart from the case-side diaphragm. The ultrasonic element includes an element-side diaphragm having the thickness direction along the directional axis and provided by a thin part of a semiconductor substrate. The semiconductor substrate is arranged to provide a closed space between the case-side diaphragm and the element-side diaphragm. The semiconductor substrate is fixed and supported by the element-storage case.


Find Patent Forward Citations

Loading…