IDiyas

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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11444596 B1

PDFFull Text
Date of Patent:
Sep. 13, 2022

Filed:

Apr. 26, 2018

Acoustic wave device

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Daisuke Sekiya, Nagaokakyo, JP;

Yasuhiko Hirano, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Derek J Rosenau

Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/10 (2006.01); H01L 41/047 (2006.01); H03H 9/05 (2006.01); H03H 9/25 (2006.01); H01L 23/00 (2006.01); H03H 9/145 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02897 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H03H 9/02559 (2013.01); H03H 9/059 (2013.01); H03H 9/0576 (2013.01); H03H 9/1071 (2013.01); H03H 9/1092 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01); H03H 9/64 (2013.01); H01L 41/0477 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/11 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/3512 (2013.01);
Abstract

An acoustic wave device includes a piezoelectric substrate, an IDT electrode and an electrode pad provided on a front surface of the piezoelectric substrate, a support layer provided on the front surface so as to surround the IDT electrode, a first cover layer and a second cover layer provided on the support layer such that the first cover layer, the second cover layer, the support layer, and the piezoelectric substrate seal the IDT electrode in a hollow space, a UBM portion joined to the electrode pad, and a bump joined to the UBM portion. A joint surface of the UBM portion at which the UBM portion is joined to the bump has a spherical shape or substantially spherical shape that is convex towards the bump side.

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