logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11444405 B1

PDFFull Text
Date of Patent:
Sep. 13, 2022

Filed:

Jan. 12, 2021

Card-type connector having heat conductive members extending over terminals thereof

Applicant:

Japan Aviation Electronics Industry, Limited, Tokyo, JP;

Inventor:

Tomohiro Nakamura, Tokyo, JP;

Assignee:

JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED, Tokyo, JP;

Attorney:

Holtz, Holtz & Volek PC

Primary Examiner:

Abdullah A Riyami

Assistant Examiner:

Justin M Kratt

Int. Cl.
CPC ...
H01R 13/502 (2006.01); H01R 12/71 (2011.01); H01R 12/88 (2011.01); H01R 33/76 (2006.01); H01R 33/97 (2006.01); H01R 12/70 (2011.01); H01R 12/83 (2011.01); G06K 7/00 (2006.01); H01R 12/85 (2011.01); H01L 23/40 (2006.01); H01R 13/24 (2006.01); H01R 13/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/5025 (2013.01); G06K 7/0056 (2013.01); H01R 12/7076 (2013.01); H01R 12/716 (2013.01); H01R 12/83 (2013.01); H01R 12/88 (2013.01); H01R 33/7685 (2013.01); H01R 33/97 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4037 (2013.01); H01L 2023/4056 (2013.01); H01L 2023/4068 (2013.01); H01R 12/71 (2013.01); H01R 12/85 (2013.01); H01R 13/00 (2013.01); H01R 13/2442 (2013.01);
Abstract

A base of a connector defines an accommodation portion for accommodating a card-type device. The base has holding portions with surfaces directed to the accommodation portion. The holding portions hold held portions of terminals. Heat conductive members are provided on the surfaces of the holding portions. The heat conductive members are sandwiched between the card-type device and the holding portions when the card-type device is connected to the connector. In this way, heat conductive paths, which include the conductive members, are formed between the card-type device and held portions of the terminals

Find Patent Forward Citations

Loading…