The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Sep. 24, 2020
Applicant:

Fci Usa Llc, Etters, PA (US);

Inventors:

Jason Si, Toronto, CA;

Ba Pham, Toronto, CA;

Xingye Chen, Markham, CA;

Sam Kocsis, Nashua, NH (US);

Assignee:

FCI USA LLC, Etters, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/46 (2006.01); H01R 13/658 (2011.01); H01R 24/60 (2011.01);
U.S. Cl.
CPC ...
H01R 13/46 (2013.01); H01R 13/658 (2013.01); H01R 24/60 (2013.01);
Abstract

A stacked I/O connector for use with a high speed, high density transceiver that generates a large amount of heat. The connector may be formed with a web-like housing into which leadframe assemblies are inserted. The web-like housing may have openings in the front, back, top and/or sides, enabling airflow through the connector with little resistance. Sidewall openings may open into a channel between the housing and a wall of cage, enabling air flowing to cool transceivers inserted into the cage to pass through the connector assembly with low resistance and high cooling efficiency. A cage for the connector may have openings selectively positioned such that air flowing through the cage to cool transceivers mated to the I/O connector may pass through the connector with low resistance, enhancing cooling efficiency. Such a connector may be used with OSFP transceivers to meet signal integrity and thermal requirements at 112 GBps and beyond.


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