The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Nov. 25, 2020
Applicant:

Amphenol Corporation, Wallingford, CT (US);

Inventors:

Philip T. Stokoe, Attleboro, MA (US);

Djamel Hamiroune, Nashua, NH (US);

Assignee:

AMPHENOL CORPORATION, Wallingford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/514 (2006.01); H01R 12/71 (2011.01); H01R 13/6471 (2011.01); H01R 12/72 (2011.01); H01R 13/6587 (2011.01);
U.S. Cl.
CPC ...
H01R 12/716 (2013.01); H01R 13/6471 (2013.01); H01R 12/724 (2013.01); H01R 13/514 (2013.01); H01R 13/6587 (2013.01);
Abstract

A connector module for an electrical connector that has at least one wafer assembly with at least one conductive member and at least one contact wafer. The contact wafer includes a plurality of contacts including at least one signal contact and at least one ground contact. Each of the contacts has a board engagement end configured to engage a printed circuit board and a mating interface end opposite thereof and configured to connect with a contact of a mating connector module. A grounding gasket receives the board engagement ends of the contacts of the wafer assembly. The grounding gasket has at least one portion in electrical contact with the ground contact of the plurality of contacts. The ground contact of the contact wafer is in electrical contact with both the conductive member and the grounding gasket, thereby defining a grounding path through the connector module to the board.


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