The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Sep. 30, 2020
Applicant:
Lite-on Singapore Pte. Ltd., Singapore, SG;
Inventors:
Assignee:
LITE-ON SINGAPORE PTE. LTD., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 29/16 (2006.01); H01L 31/12 (2006.01); H01L 33/00 (2010.01); H01L 31/16 (2006.01); H01L 27/14 (2006.01); H01L 31/0203 (2014.01);
U.S. Cl.
CPC ...
H01L 31/16 (2013.01); H01L 27/14 (2013.01); H01L 27/15 (2013.01); H01L 31/0203 (2013.01);
Abstract
A sensor package array, a method of manufacturing the same, and a sensor package structure are provided. The method of manufacturing a sensor package array including: disposing a plurality of sensors on a substrate sequentially in an array; electrically connecting the plurality of sensors to the substrate; disposing a plastic shield on the substrate, so as to form a plurality of channels and a plurality of accommodating grooves among the plastic shield, the substrate, and the plurality of sensors; and filling a sealing material in the plurality of accommodating grooves, through the plurality of channels.