The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Dec. 22, 2020
Applicant:

Allegro Microsystems, Llc, Manchester, NH (US);

Inventors:

Ravi Vig, Bedford, NH (US);

William P. Taylor, Amherst, NH (US);

Paul A. David, Bow, NH (US);

P. Karl Scheller, Dover, NH (US);

Andreas P. Friedrich, Metz-Tessy, FR;

Assignee:

Allegro MicroSystems, LLC, Manchester, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/82 (2006.01); G01R 33/06 (2006.01); G01R 33/00 (2006.01); G01D 5/14 (2006.01); G01R 15/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/82 (2013.01); G01D 5/147 (2013.01); G01R 33/0047 (2013.01); G01R 33/0052 (2013.01); G01R 33/06 (2013.01); G01R 15/207 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00011 (2013.01);
Abstract

A magnetic field sensor includes a lead frame, a semiconductor die, a conductive coil, a mandrel, and a non-conductive mold material. The lead frame has a first surface, a second opposing surface, at least one slot, and a plurality of leads. The semiconductor die has a first surface in which a magnetic field sensing element is disposed and a second opposing surface attached to the first surface of the lead frame. The conductive coil is secured to the second surface of the lead frame and configured to operate as a back bias magnet to provide a magnetic field used to detect movement of a target. The coil is would around the mandrel and the mandrel is comprised of a ferromagnetic material. The non-conductive mold material encloses the die, the conductive coil, the mandrel, and at least a portion of the lead frame.


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