The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Jul. 08, 2019
Applicant:

Kabushiki Kaisha Tokai-rika-denki-seisakusho, Niwa-gun, JP;

Inventor:

Yoshikazu Kataoka, Niwa-gun, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 21/762 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0255 (2013.01); H01L 21/76224 (2013.01); H01L 29/0619 (2013.01); H01L 29/401 (2013.01); H01L 29/407 (2013.01); H01L 29/66136 (2013.01);
Abstract

A semiconductor device including a protected element, an element isolation region, a contact region, and a shield region. The protected element is configured including a p-n junction diode between an anode region and a cathode region, and is arranged in an active layer of a substrate. A periphery of the diode is surrounded by the element isolation region. The contact region is arranged at a portion on a main face of the anode region, is set with a same conductivity type as the anode region, and is set with a higher impurity concentration than the anode region. The shield region is arranged between the cathode region and the contact region so as to extend from the main face of the anode region as far as a region deeper than a depth of the contact region and shallower than the anode region. The shield region is configured including a semiconductor region with an opposite conductivity type to the anode region.


Find Patent Forward Citations

Kataoka, Yoshikazu. (2022). Semiconductor device and method for manufacturing same (U.S. Patent No. 11444074). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11444074

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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