The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Jan. 29, 2021
Kioxia Corporation, Tokyo, JP;
Takuro Okubo, Yokkaichi, JP;
Hidekazu Hayashi, Yokkaichi, JP;
Kioxia Corporation, Tokyo, JP;
Abstract
A manufacturing method of a semiconductor device according to an embodiment comprises, bonding a first semiconductor substrate and a second semiconductor substrate to form a stack, filling a first fill material having a first viscosity in a gap located between an outer peripheral portion of the first semiconductor substrate and an outer peripheral portion of the second semiconductor substrate, filling a second fill material having a second viscosity higher than the first viscosity in the gap so as to be adjacent to the first fill material after filling the first fill material in the gap and thinning the second semiconductor.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile