The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Aug. 31, 2020
Applicant:

Kioxia Corporation, Minato-ku, JP;

Inventors:

Kaito Shirai, Nagoya, JP;

Hanae Ishihara, Yokkaichi, JP;

Assignee:

Kioxia Corporation, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 27/11582 (2017.01); H01L 27/1157 (2017.01); H01L 23/522 (2006.01); H01L 27/11573 (2017.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 23/528 (2013.01); H01L 27/1157 (2013.01); H01L 27/11573 (2013.01); H01L 27/11582 (2013.01);
Abstract

A semiconductor memory device includes a semiconductor substrate, a memory cell array, and first and second wirings. The semiconductor substrate includes first region to third region and fourth region to sixth region. The memory cell array includes first conducting layers extending in a second direction from the first region to the third region and laminated in a first direction, first and second semiconductor layers disposed in the first and third regions, extending in the first direction, and opposed to the first conducting layers, first and second contacts disposed in the fourth and sixth regions and extending in the first direction, and a third semiconductor layer disposed in the fifth region and extending in the first direction. The first wiring is connected to the first semiconductor layer and the second contact. The second wiring is connected to the second semiconductor layer and the third contact.


Find Patent Forward Citations

Loading…