The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Nov. 06, 2020
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Masahiko Kobayakawa, Kyoto, JP;
Kazuhiro Mireba, Kyoto, JP;
Shintaro Yasuda, Kyoto, JP;
Junichi Itai, Kyoto, JP;
Taisuke Okada, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/62 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/488 (2006.01); H01L 33/48 (2010.01); H01L 33/52 (2010.01); H01L 25/075 (2006.01); H01L 33/64 (2010.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01); H01L 23/48 (2006.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 23/31 (2013.01); H01L 23/48 (2013.01); H01L 23/488 (2013.01); H01L 23/495 (2013.01); H01L 23/4951 (2013.01); H01L 23/49503 (2013.01); H01L 23/49517 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 25/0753 (2013.01); H01L 33/48 (2013.01); H01L 33/483 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H01L 33/642 (2013.01); H01L 33/647 (2013.01); H01L 25/167 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01);
Abstract
A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.