logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11443890 B1

PDFFull Text
Date of Patent:
Sep. 13, 2022

Filed:

Jun. 25, 2018

Surface mount coil component and manufacturing method for the same, and dc-dc converter

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Noboru Kato, Nagaokakyo, JP;

Satoshi Ishino, Nagaokakyo, JP;

Mitsuyoshi Nishide, Nagaokakyo, JP;

Shinichiro Banba, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Mang Tin Bik Lian

Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 41/10 (2006.01); H01F 17/04 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01); H02M 3/155 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01); H02M 3/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 17/04 (2013.01); H01F 27/24 (2013.01); H01F 27/2823 (2013.01); H01F 27/32 (2013.01); H01F 41/0206 (2013.01); H01F 41/04 (2013.01); H01F 41/10 (2013.01); H01F 2017/048 (2013.01); H02M 3/00 (2013.01); H02M 3/155 (2013.01); H05K 1/0271 (2013.01); H05K 1/165 (2013.01); H05K 1/181 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/086 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10053 (2013.01);
Abstract

A surface mount coil component includes an element body defining a compact including magnetic material particles; a coil that is buried, excluding an end portion of the coil, in the element body; and an input-output terminal electrically connected to the end portion of the coil. A thermoplastic resin layer is provided on a surface on a mounting surface side of the element body. An interlayer connection conductor is provided in the thermoplastic resin layer. The input-output terminal is provided on a surface of the thermoplastic resin layer and is electrically connected to the end portion of the coil via the interlayer connection conductor.

Find Patent Forward Citations

Loading…