The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Sep. 22, 2020
Applicant:

Getac Technology Corporation, Hsinchu County, TW;

Inventors:

Hsin-Chih Chou, Taipei, TW;

Juei-Chi Chang, Taipei, TW;

Assignee:

GETAC TECHNOLOGY CORPORATION, Hsinchu County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H01Q 1/22 (2006.01); H05K 5/02 (2006.01); H05K 5/06 (2006.01); H05K 5/00 (2006.01); H05K 5/04 (2006.01); E05D 3/02 (2006.01); E05D 5/04 (2006.01); F16C 11/04 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1656 (2013.01); E05D 3/02 (2013.01); E05D 5/04 (2013.01); F16C 11/04 (2013.01); G06F 1/1654 (2013.01); G06F 1/1679 (2013.01); G06F 1/1683 (2013.01); G06F 1/1698 (2013.01); H01Q 1/2266 (2013.01); H05K 5/0017 (2013.01); H05K 5/0204 (2013.01); H05K 5/04 (2013.01); H05K 5/061 (2013.01); H05K 5/069 (2013.01); E05Y 2900/606 (2013.01); G06F 1/1616 (2013.01);
Abstract

The present invention discloses an expansion electronic system and an electronic system. The expansion electronic device is adapted to be joined with a primary electronic device into one integral and to operate cooperatively. The expansion electronic device includes a housing and a plurality of functional modules. The housing has an assembly surface on a top side thereof and a plurality of individually independent receiving chambers on a bottom side thereof. The assembly surface is configured to join with the primary electronic device, and a first waterproof space is formed by means of structural interference between the assembly surface and the primary electronic device. The plurality of functional modules are disposed in the plurality of receiving chambers, respectively, and are individually installed or removed. A second waterproof space is formed by means of structural interference between one of the receiving chambers and the corresponding functional module.


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