The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Aug. 19, 2021
Applicant:

Fastcap Systems Corporation, Boston, MA (US);

Inventors:

Yong Joon Lee, Burlington, MA (US);

William J. Scimeca, Boston, MA (US);

Nicolo Brambilla, Brookline, MA (US);

Daniel Rich, Cambridge, MA (US);

Assignee:

FASTCAP SYSTEMS CORPORATION, Boston, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 21/06 (2006.01); B32B 25/08 (2006.01); B32B 27/20 (2006.01); H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); B29K 101/12 (2006.01); B29K 507/04 (2006.01); B29L 31/18 (2006.01); B29C 43/00 (2006.01); B29C 43/20 (2006.01); B29C 43/32 (2006.01); B29C 69/00 (2006.01);
U.S. Cl.
CPC ...
F28F 21/065 (2013.01); B29C 43/003 (2013.01); B29C 43/203 (2013.01); B29C 43/32 (2013.01); B29C 69/001 (2013.01); B32B 25/08 (2013.01); B32B 27/20 (2013.01); H01L 23/3675 (2013.01); H01L 23/3733 (2013.01); H05K 7/20481 (2013.01); B29K 2101/12 (2013.01); B29K 2507/04 (2013.01); B29K 2995/0013 (2013.01); B29L 2031/18 (2013.01); B32B 2307/302 (2013.01);
Abstract

A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.


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