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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11441636 B1

PDFFull Text
Date of Patent:
Sep. 13, 2022

Filed:

Jun. 16, 2020

Bearing assembly

Applicants:

Inventec (Pudong) Technology Corporation, Shanghai, CN;

Inventec Corporation, Taipei, TW;

Inventors:

Chi-Cheng Hsiao, Taipei, TW;

Ying-Chao Peng, Taipei, TW;

Chun-Ying Yang, Taipei, TW;

Assignees:

INVENTEC (PUDONG) TECHNOLOGY CORPORATION, Shanghai, CN;

INVENTEC CORPORATION, Taipei, TW;

Attorneys:

Locke Lord LLP

Tim Tingkang Xia, Esq.

Primary Examiner:

Adam D Rogers

Int. Cl.
CPC ...
F16F 15/02 (2006.01); F16F 1/36 (2006.01); H05K 5/02 (2006.01); H05K 5/00 (2006.01); F16F 1/373 (2006.01); F16F 3/087 (2006.01);
U.S. Cl.
CPC ...
F16F 15/02 (2013.01); F16F 1/3735 (2013.01); H05K 5/0073 (2013.01); H05K 5/0204 (2013.01); B60G 2204/128 (2013.01); F16F 3/0873 (2013.01); F16F 2228/06 (2013.01); F16F 2230/36 (2013.01);
Abstract

A bearing assembly configured to be disposed on casing of electronic device and including plate body, first damping component, second damping component, first fastener and second fastener. The plate body includes first mounting hole and second mounting hole. The first damping component is disposed in the first mounting hole. The first damping component includes first hole. The second damping component is disposed in the second mounting hole. The second damping component includes second hole. The first fastener is disposed in the first hole of the first damping component and configured to be fixed to the casing of the electronic device. The second fastener is disposed in the second hole of the second damping component and configured to be fixed to the casing of the electronic device. A hardness of the first damping component is greater than a hardness of the second damping component.

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