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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11441071 B1

PDFFull Text
Date of Patent:
Sep. 13, 2022

Filed:

Dec. 04, 2019

Etchant composition and methods for manufacturing metal pattern and array substrate using the same

Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Bong-Kyun Kim, Hwaseong-si, KR;

JinSeuk Kim, Suwon-si, KR;

SeungBo Shim, Anyang-si, KR;

ShinHyuk Choi, Suwon-si, KR;

Seung-Hee Kim, Cheonan-si, KR;

Donghee Lee, Hwaseong-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:

H.C. Park & Associates, PLC

Primary Examiner:

Jiong-Ping Lu

Int. Cl.
CPC ...
C09K 13/08 (2006.01); H01L 29/45 (2006.01); H01L 21/3213 (2006.01); H01L 27/12 (2006.01); C23F 1/10 (2006.01); C23F 1/16 (2006.01); C09K 13/00 (2006.01); C23F 1/02 (2006.01); C23F 1/18 (2006.01); C23F 1/26 (2006.01); C23F 1/44 (2006.01); G03F 7/20 (2006.01); H01L 21/306 (2006.01); H01L 21/311 (2006.01); C09K 13/06 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
C09K 13/08 (2013.01); C09K 13/00 (2013.01); C09K 13/06 (2013.01); C23F 1/02 (2013.01); C23F 1/10 (2013.01); C23F 1/16 (2013.01); C23F 1/18 (2013.01); C23F 1/26 (2013.01); C23F 1/44 (2013.01); G03F 7/2014 (2013.01); H01L 21/30604 (2013.01); H01L 21/31111 (2013.01); H01L 21/3213 (2013.01); H01L 21/32134 (2013.01); H01L 27/1259 (2013.01); H01L 29/458 (2013.01); G02F 1/1368 (2013.01);
Abstract

An etchant composition of an embodiment includes a persulfate, a four-nitrogen ring compound, a two-chlorine compound, a fluorine compound and water, and has a weight ratio of the four-nitrogen ring compound and the two-chlorine compound of about 1:0.5 to about 1:4. The etchant composition may etch a multilayer metal substrate of titanium/copper and may be used for manufacturing a multilayer metal pattern and an array substrate having excellent properties of etched patterns.

Find Patent Forward Citations

Kim, Bong-Kyun. (2022). Etchant composition and methods for manufacturing metal pattern and array substrate using the same (U.S. Patent No. 11441071). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11441071

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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