The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Mar. 19, 2021
Microjet Technology Co., Ltd., Hsinchu, TW;
Hao-Jan Mou, Hsinchu, TW;
Rong-Ho Yu, Hsinchu, TW;
Cheng-Ming Chang, Hsinchu, TW;
Hsien-Chung Tai, Hsinchu, TW;
Wen-Hsiung Liao, Hsinchu, TW;
Chi-Feng Huang, Hsinchu, TW;
Yung-Lung Han, Hsinchu, TW;
MICROJET TECHNOLOGY CO., LTD., Hsinchu, TW;
Abstract
A narrow type inkjet print head chip is disclosed and includes a silicon substrate, an active component layer and a passive component layer. The active component layer is stacked on the silicon substrate and includes plural ESD protection units, plural encoder switches, plural discharge protection units and plural heater switches. The ESD protection units, the encoder switches, the discharge protection units and the heater switches are disposed in each of at least two high-precision regions of the active component layer. The corresponding positions and quantities of these components are the same in the at least two high-precision regions. The passive component layer is stacked on the active component layer and includes plural heaters, plural electrode pads, plural encoders and plural circuit traces. The circuit traces are electrically connected to the ESD protection units, the encoder switches, the heater switches, the heaters, the electrode pads and the encoders.