The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Feb. 09, 2021
Applicant:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventors:

JengPing Lu, Fremont, CA (US);

Eugene M. Chow, Palo Alto, CA (US);

Sourobh Raychaudhuri, Mountain View, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B32B 37/10 (2006.01); B32B 38/04 (2006.01); B32B 38/18 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
B32B 37/025 (2013.01); B32B 37/0046 (2013.01); B32B 37/10 (2013.01); B32B 38/04 (2013.01); B32B 38/1808 (2013.01); B32B 2457/14 (2013.01); H01L 21/67721 (2013.01);
Abstract

Sheets of a thin film material are attached to a carrier wafer. The carrier wafer and the attached sheets of thin film material are separated to form chiplet carriers. Each chiplet carrier includes a portion of the sheets of thin film material attached to a portion of the carrier wafer. The chiplet carriers are placed on an assembly surface in a random pattern. The chiplet carriers are arranged from the random pattern to a predetermined pattern, and the portions of the thin film material are transferred from the chiplet carriers to a target substrate.


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