The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Apr. 23, 2015
Applicant:
Teijin Limited, Osaka, JP;
Inventors:
Takashi Toyozumi, Osaka, JP;
Syuhei Suzuki, Osaka, JP;
Assignee:
Teijin Limited, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/14 (2006.01); B23C 5/10 (2006.01); B23C 3/00 (2006.01); B29C 70/06 (2006.01); C08J 5/04 (2006.01); B29C 70/42 (2006.01); C08J 5/24 (2006.01); B29K 101/12 (2006.01); B29K 105/12 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
B29C 70/14 (2013.01); B23C 3/00 (2013.01); B23C 5/10 (2013.01); B29C 70/06 (2013.01); B29C 70/42 (2013.01); C08J 5/04 (2013.01); C08J 5/042 (2013.01); C08J 5/24 (2013.01); B23C 2210/0442 (2013.01); B23C 2210/0485 (2013.01); B23C 2226/27 (2013.01); B29K 2101/12 (2013.01); B29K 2105/12 (2013.01); B29K 2307/04 (2013.01); C08J 2300/22 (2013.01); C08J 2377/02 (2013.01); Y10T 428/249945 (2015.04); Y10T 428/31 (2015.01);
Abstract
The present invention is aimed to provide a carbon fiber reinforced resin processed product which is almost free from the problems described above on a processed surface subjected to cutting or the like and has an end surface where generation of a burr is suppressed, has favorable surface properties, and surface nature, and particularly smoothness is excellent; and provides a carbon fiber reinforced resin processed product having an end surface which has fibers and a resin, wherein the end surface has a surface roughness (Rz) within a range from 5 μm to 50 μm.