The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Jan. 31, 2018
Hewlett-packard Development Company, L.p., Spring, TX (US);
Greg Scott Long, Corvallis, OR (US);
Phil D Matlock, Corvallis, OR (US);
Jake Wright, San Diego, CA (US);
David L Erickson, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Abstract
Some examples include an additive manufacturing method for controlling electrostatic discharge of a build object. The method includes receiving data related to a build object, the data including conductivity data, selectively depositing a first portion of a printing agent onto a build material layer in a pattern of an object layer of a build object, the printing agent being electrically conductive at a predetermined dosage, the first portion deposited at less than the predetermined dosage, selectively depositing a second portion of the printing agent onto the build material layer at an area of the pattern, the printing agent at the area deposited at or above the predetermined dosage, and applying fusing energy to form the object layer, the object layer of the build object including a shell formed at the area and a core, the shell being electrically conductive and the core being electrically non-conductive.