The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Sep. 28, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Uday Pai, San Jose, CA (US);

Jeonghoon Oh, Saratoga, CA (US);

Van H. Nguyen, Milpitas, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/32 (2012.01); B24B 37/30 (2012.01);
U.S. Cl.
CPC ...
B24B 37/32 (2013.01); B24B 37/30 (2013.01);
Abstract

Apparatus and methods relating to chemical mechanical polishing (CMP) are described herein. An edge load ring (ELR) is configured to fit inside a retaining ring of a CMP head. The ELR includes an annular body having an inner surface and an outer surface opposite the inner surface, the outer surface having a diameter configured to slip inside a retaining ring. The annular body includes a body portion formed from a first material and a bottom projection extending below the body portion. The bottom projection has a bottom surface facing away from the body portion, and the bottom projection is formed form a second material different from the first material. The annular body includes a venting feature formed through the annular body, the venting feature being in fluid communication between the inner and outer surfaces.


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