The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Jun. 07, 2019
Applicant:

Applied Materials Israel Ltd., Rehovot, IL;

Inventor:

Yehuda Zur, Rehovot, IL;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/08 (2006.01); B23Q 15/22 (2006.01); B23Q 1/70 (2006.01); H01J 37/305 (2006.01); B23Q 1/30 (2006.01); B27C 5/00 (2006.01);
U.S. Cl.
CPC ...
B23Q 15/225 (2013.01); B23Q 1/30 (2013.01); B23Q 1/706 (2013.01); B27C 5/00 (2013.01); H01J 37/3056 (2013.01); H01J 2237/3114 (2013.01); H01J 2237/31749 (2013.01);
Abstract

A miller, a non-transitory computer readable medium, and a method for milling a multi-layered object. The method may include (i) receiving or determining milling parameters related to a milling process, the milling parameters may include at least two out of (a) a defocus strength, (b) a duration of the milling process, (c) a bias voltage supplied to an objective lens during the milling process, (d) an ion beam energy, and (e) an ion beam current density, and (ii) forming a crater by applying the milling process while maintaining the milling parameters, wherein the applying of the milling process includes directing a defocused ion beam on the multi-layered object.


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