The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Sep. 27, 2019
Applicant:
Jian Zhang, Brookline, MA (US);
Inventor:
Jian Zhang, Brookline, MA (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/00 (2006.01); B23K 3/047 (2006.01); H01L 23/00 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01); B23K 3/06 (2006.01);
U.S. Cl.
CPC ...
B23K 3/047 (2013.01); B23K 3/0623 (2013.01); H01L 21/681 (2013.01); H01L 21/68707 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/742 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 2224/117 (2013.01);
Abstract
A unitary wafer assembly arrangement for the application of solder balls onto a substrate for subsequent use in the electronics industry. This wafer tool assembly comprises a number of modules connected to one another and all serviced by a robotic arm to transfer processed wafers from one module to another. The tool assembly comprises a load port and pre-aligner module, a binder module, a solder ball mount module and a reflow module. A wafer inspection and repair module arrangement is also part of the tool assembly.