The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Jun. 08, 2016
Applicant:
Fuji Corporation, Chiryu, JP;
Inventors:
Yoshitaka Hashimoto, Kariya, JP;
Masatoshi Fujita, Anjyo, JP;
Kenji Tsukada, Toyota, JP;
Akihiro Kawajiri, Chiryu, JP;
Masato Suzuki, Miyoshi, JP;
Katsuaki Makihara, Gamagori, JP;
Assignee:
FUJI CORPORATION, Chiryu, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H05K 3/12 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/287 (2013.01); H05K 3/125 (2013.01); H05K 3/28 (2013.01); H05K 3/284 (2013.01); H05K 3/285 (2013.01); H05K 3/30 (2013.01); H05K 3/303 (2013.01); H05K 3/32 (2013.01); H05K 1/185 (2013.01); H05K 3/0014 (2013.01); H05K 2203/013 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1322 (2013.01); H05K 2203/1327 (2013.01); H05K 2203/1377 (2013.01);
Abstract
In a circuit forming device, a resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into a cavity of the resin laminated body, and an electronic component is placed on the ultraviolet curable resin. Then, the electronic component is cured and the electronic component is fixed.