The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Sep. 27, 2019
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Masakazu Sakamoto, Tokushima, JP;

Masaaki Katsumata, Anan, JP;

Tomohisa Kishimoto, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 3/42 (2006.01); H05K 3/10 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/184 (2013.01); H05K 1/0283 (2013.01); H05K 1/188 (2013.01); H05K 3/10 (2013.01); H05K 3/32 (2013.01); H05K 3/425 (2013.01); H05K 3/4611 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A printed circuit board includes a printed wiring board, a semiconductor element, and conductive members. The printed wiring board includes an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. The semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. The conductive members filled in the through-holes connect the element terminals and the wiring.


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