The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Oct. 10, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Layne A. Berge, Rochester, MN (US);

Paul E. Dahlen, Rochester, MN (US);

Pat Rosno, Rochester, MN (US);

Timothy Schmerbeck, Mantorville, MN (US);

Kyle Schoneck, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0237 (2013.01); H05K 1/111 (2013.01); H05K 3/303 (2013.01); H05K 1/115 (2013.01); H05K 2201/09418 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01);
Abstract

Surface mount device (SMD) placement to control a signal path in a printed circuit board (PCB), including: adding, to a PCB, a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and coupling, via a discrete SMD, the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments.


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