The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Oct. 27, 2020
Applicant:

Nvidia Corporation, Santa Clara, CA (US);

Inventors:

Mingyi Yu, Saratoga, CA (US);

Ananta H. Attaluri, San Jose, CA (US);

Gregory Patrick Bodi, Santa Cruz, CA (US);

Carmen A. Capillo, Jr., Hollister, CA (US);

Michael James Warner, Fort Mill, SC (US);

Assignee:

NVIDIA Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H05K 1/0228 (2013.01); H05K 3/0029 (2013.01); H05K 3/423 (2013.01); H05K 2201/09954 (2013.01);
Abstract

A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.


Find Patent Forward Citations

Yu, Mingyi. (2022). Inter-layer slot for increasing printed circuit board power performance (U.S. Patent No. 11439002). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11439002

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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