The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Apr. 12, 2019
Applicant:

Sony Corporation, Tokyo, JP;

Inventor:

Shinji Miyazawa, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/374 (2011.01); H01L 27/146 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 21/3205 (2006.01); H01L 27/092 (2006.01); H04N 5/225 (2006.01); H04N 5/341 (2011.01);
U.S. Cl.
CPC ...
H04N 5/3742 (2013.01); H01L 21/3205 (2013.01); H01L 21/768 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 27/0928 (2013.01); H01L 27/1469 (2013.01); H01L 27/14621 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H04N 5/2253 (2013.01); H04N 5/2257 (2013.01); H04N 5/341 (2013.01); H04N 5/374 (2013.01); H01L 27/1464 (2013.01); H01L 27/14618 (2013.01); H01L 27/14641 (2013.01); H01L 27/14645 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/73257 (2013.01);
Abstract

The present disclosure relates to a solid-state imaging apparatus, a manufacturing method of the same and an electronic device which can make an apparatus size further smaller. A solid-state imaging apparatus includes: a laminate of a first structure in which a pixel array unit in which pixels that perform photoelectric conversion are two-dimensionally arranged is formed and a second structure in which an output circuit unit configured to output pixel signals output from the pixels to an outside of an apparatus is formed. The output circuit unit, a first through hole via which penetrates through a semiconductor substrate constituting part of the second structure, and an external terminal for signal output connected to the outside of the apparatus are disposed below the pixel array unit of the first structure. The present disclosure can be applied, for example, to a solid-state imaging apparatus or the like.


Find Patent Forward Citations

Loading…