The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Oct. 29, 2020
Applicant:
Dupont Electronics, Inc., Wilmington, DE (US);
Inventors:
Gregory Scott Blackman, Media, PA (US);
Wei Wu, Hockessin, DE (US);
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02J 50/10 (2016.01); H01F 41/26 (2006.01); H01F 5/00 (2006.01); H02J 50/00 (2016.01);
U.S. Cl.
CPC ...
H02J 50/10 (2016.02); H01F 5/003 (2013.01); H01F 41/26 (2013.01); H02J 50/005 (2020.01);
Abstract
A conductive structure is fabricated on a substrate (either flexible or rigid) by first printing a precursor seed layer of a conductive ink, then electroplating a highly conductive metal such as Cu or Ag onto the precursor. The plated layer has a conductivity approaching that of the bulk metal. To improve the uniformity of plating, an intervening layer of electroless metal may be deposited onto the precursor prior to electroplating. The structure may be used for applications such as coils used in a wireless power transfer system.